长鑫存储首次量产HBM3E，缩小AI内存差距

AI 摘要

中国存储芯片制造商长鑫存储（CXMT）首次小批量生产HBM3E高带宽内存，用于AI处理器。该产品比三星、SK海力士和美光落后一代，后者已量产HBM4。阿里巴巴的平头哥和寒武纪正在测试该内存，计划2027年用于产品，这可能缓解美国出口限制对中国AI芯片的影响。CXMT在技术上落后3-5年，良率约25%，其上海IPO募资86亿美元，但未指定用于HBM。

正文节选

China's CXMT makes its first HBM3E chips, closing the AI memory gap China's top memory maker ChangXin Memory Technologies (CXMT) is producing HBM3E for the first time in small quantities, a fast memory found in many current AI processors. That's according to a report from The Information, citing two insiders. HBM (High Bandwidth Memory) consists of stacked memory chips placed right next to the processor, and it's needed to train and run large AI models. That puts CXMT a generation behind Samsung

发布时间：2026-08-31 23:17

抓取时间：2026-08-31 23:29

来源机构：THE DECODER