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AWS与高通合作定制AI推理芯片,高通采用Bedrock加速设计

原标题:AWS is using Qualcomm for AI inference while Qualcomm uses AWS Bedrock to design the chips

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AI 摘要

AWS 与高通宣布合作,高通将为 AWS 设计多代定制 AI 推理芯片,并共同开发高达 1.6 Tbps 的光互连技术。作为回报,高通将使用 AWS 的 Bedrock 服务加速其芯片设计流程。这是亚马逊继 Trainium、Graviton 和 Nitro 之后的又一芯片布局,旨在提升 AI 推理能效。高通目标到 2029 年实现 150 亿美元的数据中心收入。

以上摘要由 AI 生成,可能存在误差。事实请以原文为准。

正文节选

AWS is using Qualcomm for AI inference while Qualcomm uses AWS Bedrock to design the chips Qualcomm is designing custom chips for AWS across multiple product generations, with a focus on AI inference. The two companies are also working on optical interconnects with bandwidth up to 1.6 terabits to handle the growing data traffic in AI infrastructure. Qualcomm brings its track record in power-efficient chip design, while Amazon contributes its cloud infrastructure. In return, Qualcomm uses AWS ser


发布时间:2026-09-09 20:27
抓取时间:2026-09-09 21:04
来源机构:THE DECODER
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