将自动化程序修复扩展到固件层安全补丁生成
原标题：From Silicon to Boot Code: Extending Automated Program Repair to Firmware-Layer Security Workarounds
AI 摘要
该研究将自动化程序修复（APR）方法从芯片设计阶段扩展到固件层，针对EDK II UEFI固件中的安全漏洞。研究者开发了自动提交聚类挖掘器，从完整提交历史中恢复修复模板，并构建了四个独立定位器，分别针对Spectre v1、解压库CVE、RSB填充和HOB整数溢出，均实现100%召回率。该方法可自动生成固件安全补丁，减少人工工作，并揭示了跨过程别名分析等挑战。
正文节选
From Silicon to Boot Code: Extending Automated Program Repair to Firmware-Layer Security Workarounds Abstract. Automated program repair (APR) research has been constrained to design time. Current techniques localize and fix bugs in Register-Transfer Level (RTL) or High Level Synthesis (HLS) designs before a chip reaches production. Once a hardware vulnerability surfaces post-silicon, the patch content must be manually generated. Existing automation methods address patch deployment but not patch